The first modular AI data preprocessing layer DIN has officially launched the pre-mining of Chipper nodes, which will continue until December 4th. The DIN node pre-mining is mainly used to produce xDIN, which is the primary basis for the DIN token airdrop. During the pre-mining period, Wafer point holders can convert Wafer into xDIN, and node holders can earn xDIN and $BNB by running nodes. Users with significant computing power resources can apply to become node delegates, earning more xDIN by operating delegated nodes. Currently, xDIN is an on-chain point token that does not support transfers, but it can be traded on the OTC trading platform Tadle. It is important to note that trading may lead to the loss of airdrop eligibility, and users can choose whether to trade. At the DIN TGE, all users will receive a DIN airdrop based on their xDIN holdings. Notably, this portion of the DIN airdrop will be 100% released, with no locking or complex mechanisms such as linear unlocking.